Reciprocating wafer polishing machine SMM 1300
Introduction of reciprocating wafer polishing machine
Feature
– The working surface is adsorbed by vacuum pump with vacuum chuck to make the workpiece stick firmly on the working surface, which is suitable for polishing high-quality surface plate.
– The polishing wheel is easy to change, easy to operate and debug, and the polishing time can be set according to the work needs.
– Waxing method can be selected, solid wax or spray liquid wax.
– The whole machine adopts PLC programming control program.
Specifications
| Polishing motor power | 2.2 kw |
| Polishing motor rotation speed | 0-6500 rpm |
| Reciprocation motor power | 400 w |
| Conveyor machine power | 0.55 kw |
| Feeding speed | 0-10 m/min |
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